Chemical Mechanical Planarization (CMP) wafer polishing tables and plates require strong abrasion, corrosion resistance, and extreme stiffness to produce pristine flat, polished surfaces. Johncera Direct Sintered Al2O3 components deliver this high performance for CMP polishing tables, plates, and other critical components for semiconductor and flat panel display applications.

Johncera alumina wafer polishing plate/turn table is made of high purity 99.7-99.9% alumina. High-purity alumina ceramic features outstanding rigidity and excellent wear-resistance for wafer polishing and maintains good surface shape over a long period of time.It is shaped by PIBM. It is a member of the semiconductor industry because of its unparalleled thermal and dimensional stability and resistance to severe microchip processing equipment environments.

Applications : 

As an essential part of the CMP chemical mechanical polishing process.CMP is an essential process in the production of sapphire and silicon wafers. 

johncera' s alumina ceramic sapphire grinding wafer polishing is shaped by the PIBM production process. This is an internationally advanced technology that successfully solves the problem of cracking and deformation of large sized alumina ceramics, and will open another window to fine ceramics.

Features :

High rigidity (Hardness, Mechanical Strength, Wear Resistance)

High chemical durability

Incomparable thermal

High purity and uniformity

Surface shape & roughness control

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