Next-generation etching technology will require more robust and reliable materials which can address concerns such as plasma corrosion, particle generation, metal contamination, and oxygen disassociation. Johncera offers anti-plasma materials which are ideal for this next generation of etching technology.

Plasma Proof Ring

Plasma Proof Rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring - held in place by the electrostatic charge.

Material : SiC

Features :

●High purity

●High plasma durability